Ausgabe zur CONTROL 2018

Bare PCB and PCB assembly, solder joints, pin position and height, etc. 2D and 3D features for challenging objects (e.g. bright / dark, matt / glossy, textureless) For further information please look here: Visit us at Control: Hall 6, Booth 6406 Find out more about the future: http://www.ait.ac.at/hpv printed matter, embos- sing (e.g. braille), security features (e.g. holograms) 3D geometry, surface quality, pores, cracks, scratches, μm defects, etc. TECHNOLOGY FOR ADVANCED INLINE QUALITY INSPECTION INLINE COMPUTATIONAL IMAGING NEW TECHNOLOGY FOR SIMULTANEOUS 2D AND 3D INLINE INSPECTION Inline Computational Imaging is specifically developed for high-performance industrial inline inspection. This technology combines cutting edge image acquisition methods with smart algorithms. It works largely independent from surface properties of the inspected objects. Optimized color images and detailed 3D depth maps are calculated in real time and enable precise quality control. HIGHLIGHTS • multiple viewing and illumination angles • works with diverse material types (glossy, matt) at the same time • enhanced 2D texture images (gloss suppression, high-dynamic-range, all-in-focus) • simultaneous 2D inspection and 3D measurement • compact, flexible and customizable setup with one camera and constant illumination • patented technology ELECTRONIC PARTS INDUSTRIAL INSPECTION PRINT INSPECTION METAL PARTS